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Products
BND-TPK01 Test Probe Kits
Name:BND-TPK01 Test Probe Kits
Type:BND-TPK01
Manufacturer:BOAND provides all kinds of IEC61032 test probes, test probe kits.Several Different accessibility probe kits are available for specific standards. Kits can be created for other standards on request. Probe Kits offer substantial cost savings not to mention added convenience
Product Description:

UL /IEC/ EN 60950 IEC61032 Test Probe Kits

Model:BND-TPK01


Product Details:

The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:

· IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)

· 50mm Impact Test Ball (BND-G500R)

· Test Pin Probe: short (BND-13)

· Rigid Finger Probe (BND-11)

· Ball Pressure Tester (BND-QY102)

· Telecom Test Probe (BND-TB12)

Meets Requirements for Testing Standard(s) including but not limited to:IEC 60950EN 60950UL 60950CSA 950

Datasheets of BND-TPK01 test probe kit:

BND-B
test probe B

IEC61032  IEC60950  IEC60335
IEC60529  IEC60045  IEC60884
IEC60745

Knurled Finger Diameter:12mm
Knurled Finger Length:80mm
Baffle Plate Diameter:50mm
Baffle Plate Length:100mm
Baffle Thickness:20mm

BND-G500R
Test Sphere 500G with ring

IEC61032  IEC60529

Diameter:50mm
Weight:227g

BND-13
Short Test Pin

IEC60065
IEC60335
IEC61032

The probe Diameter:Head 3mm Tail 4mm
The probe Length:15mm
Dam-board Diameter:25mm
Dam-board Thickness:4mm

BND-11
Rigid Test Probe 11

IEC61032
IEC60065
IEC60335
IEC60884

Nodular Finger Length:80mm
Nodular Finger Diameter:12mm
Dam-board Diameter:50mm
Dan-board Thickness:5mm

BND-TB12
12mm Telecom Test Probe

IEC60065 IEC60695 IEC60950

Probe Diameter:12mm
Probe Length:80mm
Baffle Plate Diameter:50mm

BND-QY102
Ball Pressure Apparatus

IEC60695-10-2 IEC60884
IEC60320 IEC60335
IEC60598
IEC60950

Ball diameter:5MM
Total test pressure:20N±0.2N
Samples bearing Diameter:50mm,Length:100mm Solid stainless steel cylinder

 
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